Preferred Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution. Prior experience in electronic packaging industry and/or chip design industry Established relationships within OSATs, ODMs and/or chip vendors Skills & Attributes Highly analytical and strategic thinker with quality and reliability of product in mind Skilled in DFx (x = manufacturability, reliability, and/or test) Comfortable in operating with ambiguity in fast‑evolving technology markets Excellent communication skills in English; Mandarin proficiency strongly preferred